Metallurgy for Dummies

What sre Eutectoid Alloys ?

A eutectoid alloy is similar in behavior to a eutectic alloy. A eutectic alloy is characterized by having a single melting point. This melting point is lower than that of any of the constituents, and no change in the mixture will lower the melting point any further. When a molten eutectic alloy is cooled, all of the constituents will crystallize into their respective phases at the same temperature.

This is unusually coarse pearlite in a eutectoid (0.8% carbon) steel

A eutectoid alloy is similar, but the phase change occurs, not from a liquid, but from a solid solution. Upon cooling a eutectoid alloy from the solution temperature, the constituents will separate into different crystal phases, forming a single microstructure. A eutectoid steel, for example, contains 0.77% carbon.

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Sputtering Deposition

Sputtering is a process whereby atoms are ejected from a solid target material due to bombardment of the target by energetic particles. It is commonly used for thin-film deposition, etching and analytical techniques. The incident ions set off collision cascades in the target.

When such cascades recoil and reach the target surface with an energy above the surface binding energy, an atom can be ejected. If the target is thin on an atomic scale the collision cascade can reach the back side of the target and atoms can escape the surface binding energy `in transmission’.

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Chemical Vapour Deposition (CVD)

Chemical vapor deposition (CVD) is a chemical process used to produce high-purity, high-performance solid materials. The process is often used in the semiconductor industry to produce thin films. In a typical CVD process, the wafer (substrate) is exposed to one or more volatile precursors, which react and/or decompose on the substrate surface to produce the desired deposit. Frequently, volatile by-products are also produced, which are removed by gas flow through the reaction chamber.

Chemical vapour deposition or CVD is a generic name for a group of processes that involve depositing a solid material from a gaseous phase and is similar in some respects to physical vapour deposition (PVD).

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